Semiconductor Equipment

Lapping

The OKAMOTO Product range contains machine for the abrasive process for semiconductor materials.

From slicing the Ingots to the final device, our target is the best quality and highest precision.

Our products are one step further in the direction of minimising and flexibility.

Economical Polishing and Lapping

OKAMOTO is the only manufacturer to offer a total abrasive technology solution world wide. Not only grinding but also lapping and polishing equipment and process development.

For further information please contact Okamoto Europe.

Final Polishing

OKAMOTO is the only manufacturer to offer a total abrasive solution lapping
and polishing equipment.

For further information please contact Okamoto Europe.

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