SEMICONDUCTOR
EQUIPMENT

LAPPING

The OKAMOTO Product range contains machine for the abrasive
process for semiconductor materials.
From slicing the Ingots to the final device, our target is the best
quality and highest precision.
Our products are one step further in the direction of minimising and
flexibility.

ECONOMICAL POLISHING
AND LAPPING

OKAMOTO is the only manufacturer to offer a total abrasive technology solution
world wide. Not only grinding but also lapping and polishing equipment and process
development.
For further information please contact Okamoto Europe.
Final Polishing
OKAMOTO is the only manufacturer to offer a total abrasive solution
lapping and polishing equipment.